5 ECTS credits
135 h study time
Offer 1 with catalog number 4017327ENR for all students in the 1st semester at a (E) Master - advanced level.
Content
1. Overview of the important technological steps in the manufacturing of micro- and nano devices.
2. Detailed treatment of such steps:
- Methods to obtain high purity materials.
- Mono crystalline growth
- Doping of crystals
- Manufacturing of substrates
- Electron beam systems and the manufacturing of masks and photolithography
- Dimensioning devices (geometrical factors)
- Oxidation
- Epitaxy techniques (CVD, MBE and MOCVD)
- Surface doping methods: diffusion and ion implantation
- Atomic layer deposition
- Interconnects: metallization, dielectrics deposition, silicidation
- Etching (chemical, physical methods)
- Laser ablation
3. Putting together these techniques to generate technologies for the fabrication of devices:
- Self-aligned FETs
- CMOS
- III-V technologies for and physics of high speed electronic devices
- III-V technologies for photonic devices.
4. Physics of electronic Si and III-V semiconductor devices:
- Short channel effects
- Effects of downscaling: power-delay product/reliability/solutions
- Si/Ge bipolar transistor
- Non-volatile memories/flash memories
- Schottky source/drain FET
- FINFET
- MESFET
- HEMT
5. Physics and technology of some basic semiconductor optoelectronic devices:
- Detectors
- Solar cells
- LEDs (including OLED)
6. Practical sessions: Simulation of technological processes (TCAD)
Study material
1. Written lecture notes are available on Poincaré and at the ETRO Department
2. Complementary study material:
i) VLSI Technology; Simon M. Sze; Ed.: McGraw Hill, 1983
ii) An introduction to semiconductor technology; D. V. Morgan and K. Board ; Ed. : John Wiley, 2nd edition, 1990
iii) Semiconductor Manufacturing Technology Michail Quirk & Julian Serda, Ed.: Prentice Hall 2001
iv) Basic Integrated Circuit Engineering, D.J. Hamilton & W.G. Howard, McGraw Hill, 1975
v) Fundamentals of Semiconductor Fabrication; Gary S. May and Simon S. Sze; Ed.: John Wiley, 2004; ISBN: 0-471-23279-3
vi) Semiconductor Devices, Physics and Technology, S. M. Sze & M-K Lee Ed.: John Wiley, 3rd Ed. 2013
vii) Principles of solar cells, LEDs and diodes; Adrian Kitai; Ed.: John Wiley, 2011
Competences that should be acquired:
To have a sound knowledge of the physics of technological processes that are being used to produce electronic and optoelectronic solid state devices. To acquire a basic knowledge of the physics of semiconductor electronic and optoelectronic devices. To be able to bring together technological steps or processes into a technology to produce a device with certain properties.
More specifically, the course contributes to the following globally defined learning outcomes:
The master in engineering sciences has in-depth knowledge and understanding of
1. exact sciences with the specificity of their application to engineering
3. the advanced methods and theories to schematize and model complex problems or processes
The master in engineering can
4. reformulate complex engineering problems in order to solve them (simplifying assumptions, reducing complexity)
6. correctly report on research or design results in the form of a technical report or in the form of a scientific paper
8. collaborate in a (multidisciplinary) team
The master in engineering sciences has
12. a creative, problem-solving, result-driven and evidence-based attitude, aiming at innovation and applicability in industry and society
13. a critical attitude towards one's own results and those of others
14. consciensness of the ethical, social, environmental and economic context of his/here work and strives for sustainable solutions to engineering problems including safety and quality assurance aspects
15. the flexibility and adaptability to work in an international and/or intercultural context
16. an attitude of life-long learning as needed for the future development of his/her career.
The master in electronics and information technology
17. has an active knowledge of the theory and applications of electronics, information and communication technology, from component up to system level
18. has a profound knowledge of either (i) nano- and opto-electronics and embedded systems, (ii) information and communication technology systems of (iii) measuring, modelling and control.
19. has a broad overview of the role of electronics, informatics and telecommunications in industry, business and society
20. is able to analyse, specify, design, implement, test and evaluate individual electronic devices, components and algoritjhms, for signal-processing, communication and complex systems.
21. is able to model, simulate, measure and control electronic components and physical phenomena.
22. is aware of and critical about the impact of electronics, information and communication technology on society.
The final grade is composed based on the following categories:
Other Exam determines 100% of the final mark.
Within the Other Exam category, the following assignments need to be completed:
Mode assessment
1. An oral closed book examination concerning the physics of technology and processing. Attention is not only given to the reproduction of the theoretical content, but also and predominantly to the deeper understanding via e.g. a confrontation with novel techniques, devices and technologies. The student is in principle asked two questions: one quantitative and one qualitative. Especially the second type allows probing for understanding and feeling. The student is offered to prepare his answers first on paper; then follows the oral examination and a discussion about related topics.
2. A written report about the work performed during the practical sessions, supplemented by an oral examination about the contents of the report.
The examination on the theoretical part of the course accounts for 2/3 of the final mark; the report and the examination about the lab sessions account for 1/3.
This course offer isn't part of a fixed set of graduation requirements. Hence, it is a free elective.